Optical modulators encode electrical signals to the optical domain and thus constitute a key element in high-capacity communication links 1,2 . Ideally, they should feature operation at the highest speed with the least power consumption on the smallest footprint, and at low cost 3 . Unfortunately, current technologies fall short of these criteria 4 . Recently, plasmonics has emerged as a solution offering compact and fast devices 5-7 . Yet, practical implementations have turned out to be rather elusive.Here, we introduce a 70 GHz all-plasmonic Mach-Zehnder modulator that fits into a silicon waveguide of 10 μm length. This dramatic reduction in size by more than two orders of magnitude compared with photonic Mach-Zehnder modulators results in a low energy consumption of 25 fJ per bit up to the highest speeds. The technology suggests a cheap co-integration with electronics.Mach-Zehnder modulators (MZMs) are the most versatile electro-optical converters in high-end communication systems. MZMs are unique, as they can be used to encode multiple bits within one symbol with the highest quality. They are thus instrumental in increasing the capacity of modern communication links 1 . Until now, MZMs have mostly been based on the lithium niobate material system, which requires footprints on the order of cm 2 . Recently, more compact silicon-based modulators have emerged. These devices have already shown operation at bandwidths up to 55 GHz (ref. 8), they are cost-effective, and they feature lengths on the order of hundreds of micrometres to millimetres 2,3,8-12 . Yet, complementary metal-oxide semiconductor electronics (CMOS) house hundreds of transistors on a single μm 2 , making a co-integration of today's silicon MZMs with CMOS electronics impractical 4 . In pursuit of more compact silicon modulators, various approaches have been demonstrated, such as resonant silicon ring modulators 13,14 or germanium-based electro-absorption modulators 15,16 . However, encoding advanced modulation formats is challenging 17 , and high-capacity transmission has, so far, only been achieved with MZMs 2,12 . Instead, plasmonics has drawn significant interest as an alternative solution 6,7 . In plasmonics, optical signals are converted to surface plasmon polaritons (SPPs) propagating at metal-dielectric interfaces, where they can be confined below the diffraction limit of optics 18 . This means that plasmonic devices require only a few µm 2 of footprint 19,20 . With such reduced dimensions, the technology is much closer to bridging the size gap with respect to CMOS electronics. Furthermore, there are various theoretical studies indicating that plasmonic MZMs should offer hundreds of gigahertz of bandwidth 5,21 . To date, however, there is very little experimental evidence to support this claim. Recently, a plasmonic phase modulator demonstrated operation at 40 Gbit s −1 (ref. 22). One could now envision integrating such plasmonic phase modulators into a silicon waveguide MZM configuration. However, by combining plasmonics and silicon photoni...

For nearly two decades, the field of plasmonics1 - which studies the coupling of electromagnetic waves to the motion of free electrons in a metal2 - has sought to realize subwavelength optical devices for information technology3–6, sensing7,8, nonlinear optics9,10, optical nanotweezers11 and biomedical applications12. Although the heat generated by ohmic losses is desired for some applications (e.g. photo-thermal therapy), plasmonic devices for sensing and information technology have largely suffered from these losses inherent to metals13. This has led to a widespread stereotype that plasmonics is simply too lossy to be practical. Here, we demonstrate that these losses can be bypassed by employing “resonant switching”. In the proposed approach, light is only coupled to the lossy surface plasmon polaritons in the device’s off-state (in resonance) where attenuation is desired to ensure large extinction ratios and facilitate sub-ps switching. In the on state (out of resonance), light is prevented from coupling to the lossy plasmonic section by destructive interference. To validate the approach, we fabricated a plasmonic electro-optic ring modulator. The experiments confirm that low on-chip optical losses (2.5 dB), high-speed operation (>>100 GHz), good energy efficiency (12 fJ/bit), low thermal drift (4‰ K-1), and a compact footprint (sub-λ radius of 1 μm) can be realized within a single device. Our result illustrates the potential of plasmonics to render fast and compact on-chip sensing and communications technologies.

Plasmonics provides a possible route to overcome both the speed limitations of electronics and the critical dimensions of photonics. We present an all-plasmonic 116-gigabits per second electro-optical modulator in which all the elements-the vertical grating couplers, splitters, polarization rotators, and active section with phase shifters-are included in a single metal layer. The device can be realized on any smooth substrate surface and operates with low energy consumption. Our results show that plasmonics is indeed a viable path to an ultracompact, highest-speed, and low-cost technology that might find many applications in a wide range of fields of sensing and communications because it is compatible with and can be placed on a wide variety of materials.

The performance of highly nonlinear organic electro-optic (EO) materials incorporated into nanoscale slots is examined. It is shown that EO coefficients as large as 190 pm/V can be obtained in 150 nm wide plasmonic slot waveguides but that the coefficients decrease for narrower slots. Possible mechanism that lead to such a decrease are discussed. Monte-Carlo computer simulations are performed, confirming that chromophore-surface interactions are one important factor influencing the EO coefficient in narrow plasmonic slots. These highly nonlinear materials are of particular interest for applications in optical modulators. However, in modulators the key parameters are the voltage-length product U_πL and the insertion loss rather than the linear EO coefficients. We show record-low voltage-length products of 70 Vµm and 50 Vµm for slot widths in the order of 50 nm for the materials JRD1 and DLD164, respectively. This is because the nonlinear interaction is enhanced in narrow slot and thereby compensates for the reduced EO coefficient. Likewise, it is found that lowest insertion losses are observed for slot widths in the range 60 to 100 nm.

Chip-scale integration of electronics and photonics is recognized as important to the future of information technology, as is the exploitation of the best properties of electronics, photonics, and plasmonics to achieve this objective. However, significant challenges exist including matching the sizes of electronic and photonic circuits; achieving low-loss transition between electronics, photonics, and plasmonics; and developing and integrating new materials. This review focuses on a hybrid material approach illustrating the importance of both chemical and engineering concepts. Silicon–organic hybrid (SOH) and plasmonic–organic hybrid (POH) technologies have permitted dramatic improvements in electro-optic (EO) performance relevant to both digital and analog signal processing. For example, the voltage–length product of devices has been reduced to less than 40 Vμm, facilitating device footprints of <20 μm2 operating with digital voltage levels to frequencies above 170 GHz. Energy efficiency has been improved to around a femtojoule/bit. This improvement has been realized through exploitation of field enhancements permitted by new device architectures and through theory-guided improvements in organic electro-optic (OEO) materials. Multiscale theory efforts have permitted quantitative simulation of the dependence of OEO activity on chromophore structure and associated intermolecular interactions. This has led to new classes of OEO materials, including materials of reduced dimensionality and neat (pure) chromophore materials that can be electrically poled. Theoretical simulations have helped elucidate the observed dependence of device performance on nanoscopic waveguide dimensions, reflecting the importance of material interfaces. The demonstration and explanation of the dependence of in-device electro-optic activity, voltage–length product, and optical insertion loss on device architecture (e.g., slot width) suggest new paradigms for further dramatic improvement of performance.