NaNbO(3) thin films prepared by the sol-gel method had homogeneous microstructure with an average grain size of 15-25 nm and exhibited photoinduced hydrophilic conversion under UV irradiation. However, the films had little photocatalytic oxidation activity under UV irradiation. This is the first observation that NaNbO(3) undergoes photoinduced hydrophilicity under UV irradiation.

Photoacid generating ligands, 4-(2-nitrobenzy-loxycarbonyl)catechol and 4-(6-nitroveratryloxycarbonyl)catechol, and indium tin and titanium complexes thereof, were synthesized. These metal complexes perform as positive-tone, directly photopatternable indium tin oxide (ITO) or titanium oxide film precursors. After exposure, acid-bearing selectively soluble complexes could be removed to give patterned films upon developing in aqueous base, which were transformable to the corresponding pattern-preserving metal oxide film. Micropatterning of ITO and titanium oxide films was accomplished with the photoreactivity of the 2-nitrobenzyloxycarbonyl (NBOC) and 6-nitroveratryloxycarbonyl (NVOC) moiety bearing ligands.

A method for copper deposition on glass and ceramics was investigated by direct plating on 20-30 nm thick copper inclusive titanium oxide films formed on the substrate surface. The copper inclusive titanium oxide film functioned as an adhesion layer and as a catalyst for autocatalytic copper deposition. Copper inclusive titanium oxide films were formed by pyrolysis of solution deposited 1-hydroxy phenyl ketone titanium-copper complex films. After deposition of electroless copper seed layers, 15-20 μm thick electrolytic copper films were formed, where upon thermal treatment up to 0.5 kN/m adhesion strength was attained on borosilicate glass. This process enabled electroless copper plating without the use of palladium as a catalyst on non-roughened smooth glass or ceramic substrate surfaces. The copper-titanium oxide adhesion layers were characterized and cross-sectional transmission electron microscopy illustrated the adhesion mechanism and catalyst structure. Despite poor thermal conductivity, due to properties such as transparency, smooth surface, chemical and thermal stability, coefficient of thermal resistance, dielectric constant, electrical insulation and physical strength, glass has gained attention an electronic substrate material.1-3 Two examples are in 2.5 D/3 D electronic device and RF module packaging. [4][5][6][7] In addition to these properties, abundance and availability in a wide range of shape and size make glass an attractive economic substitute for silicon in interposers. [4][5][6][7] Development of through substrate interconnect via hole formation technology for glass has progressed however, metallization technology relies on vacuum deposition, the silver mirror reaction or surface roughening followed by electroless plating for conductive seed layer formation. [8][9][10][11] Using sputtered Cu, Ti/Cu or Cr base layers, relatively high adhesion strength has been attained.12-14 However, dry processes have productivity limiting disadvantages such as size restriction, need for expensive equipment and high running cost. Therefore, economic wet methods have been studied as an alternative. In direct electroless plating methods, adhesion between the glass and the plated films has been accomplished by etching the glass surface with hydrofluoric acid, but with the sacrifice of its original transparency and smoothness. [15][16] Furthermore, employment of expensive palladium catalyst also introduces the need for a palladium removal procedure in order to prevent migration and short circuits that lead to poor device reliability. [17][18][19] Solution processed adhesion layers for direct electroless plating on glass have been demonstrated where a few tens of nanometer thick Pd-NiO, 20 Pd grafted TiO 2 , 21 or Pd-SnO 2 22 films served as catalytic anchor layers. Based on those results, the method outlined in Figure 1 for direct electroless copper plating on the substrate was investigated, where the catalytic anchor layer consisting of copper and titanium oxides was formed by pyrolysis of a metal complex film ...

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Self-cleaning glasses were prepared by coating niobia nanosheets and investigated on the performance. The coated glass heated at>450 degrees C had very low turbidity, high hardness, and excellent adhesion properties. Niobia nanosheets ([Nb(3)O(8)](-)) reacted with sodium ions (Na(+)) diffused from the glass into the films to form a crystalline phase of NaNb(3)O(8) and this phase was converted to NaNbO(3) at >450 degrees C. The films exhibited photoinduced hydrophilicity under UV irradiation but low photocatalytic oxidation activity. Excellent self-cleaning ability of the niobia nanosheet coated glass was confirmed by the Taber abrasion test, which is thought to be a candidate as self-cleaning glasses for vehicles.