The research and commercialization of SiC based power device have been burgeoning over the last decade worldwide, which is bringing about an increasing demand on lost-cost and low-defect SiC wafers. To meet this challenge, we have been continuously making efforts on improving the crystal growth and wafer processing techniques. Now, the mass-production of high quality 4-inch, 6-inch n-type and semi-insulating SiC wafers has been realized. Statistically, the micropipe density is lower than 0.5 cm-2. The resistivity of the wafers is lower than 0.02 Ω·cm and up to 108 Ω·cm for n-type and semi-insulating SiC single crystals, respectively. A state of the art processing technique has been developed to control wafer deformation and thickness within the desired values for subsequent epitaxy. The total defect number of the epitaxial layers grown on the "epi-ready" 4-inch SiC wafer is 63, and the usable area is 97.6%, indicating the high quality of our SiC substrates.

Boolean operation of geometric models is an essential element in computational geometry. An efficient approach is developed in this research to perform Boolean operation for triangulated meshes represented by B-rep. This approach is much fast and robust than many existing methods. The Octree technique is adapted to facilitate the division of the common space of two meshes in order to reduce the time of Octree's construction and intersection detection. Floating point arithmetic errors and singularity of intersections are then analyzed to guarantee the unique intersection between a segment and a face, and the continuity of intersections. A novel technique based on intersecting triangles is finally proposed to create required sub-meshes based on the type of Boolean operations. Some experimental results and comparisons with other methods are presented to prove that the proposed method is fast and robust.

In this paper the composite fracture process has been simulated via the finite element method. A micromechanics model was developed to predict the stress-strain response of a SiO2f/ SiO2 composite explicitly accounting for the local damage mechanisms such as fiber fracture and interfacial debonding. The effects of interfacial strength and fiber volume fraction on the toughness of fiber-reinforced ceramic matrix composites were investigated. The results showed that the composite failure behaviors correlated with the interface strength, which could achieve an optimum value for the elevation of the composite toughness. The increase of fiber volume fraction can make more toughening contributions.

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