In the fabrication of electronic circuits used in electronic products, molybdenum thin films are deposited on semiconductors to prevent oxidation. During the deposition, the presence of a particle or dust at the interface between the thin film and substrate causes the decrease of adhesion, performance, and life cycle. In this study, a damage measurement targeting two kinds of glass substrate, with and without particles, was performed in order to measure the change in the molybdenum thin film deposition area in the presence of a particle. Clean and dirty molybdenum thin film specimens were fabricated and directly deposited on a substrate using the sputtering method, and a reflection-type digital holographic interferometer was configured for measuring the damage. Reflection-type digital holography has several advantages; e.g., the configuration of the interferometer is simple, the measurement range can be varied depending on the magnification of a microscopic lens, and the measuring time is short. The results confirm that reflection-type digital holography is useful for the measurement of the damage and defects of thin films.

The intensity and direction of the incident beam at the sample position in synchrotron full-field transmission X-ray microscopy is subject to change. Incident-beam fluctuation in computed tomography results in significant contrast degradation of the reconstructed image. In the present study, we devised a simple method by which that problem could be corrected using sinogram normalization. According to our results, the image contrast was improved by 13%, and the artifacts were suppressed.

This paper discusses a method for eliminating geometric optics errors that can occur when combining three-dimensional thermal images using hybrid digital holography. We obtained reconstructed digital holography using phase detection autofocus technique and arbitrary tilt plane correction.