Abstract:We describe the application of scattering-type near-field optical microscopy to characterize various semiconducting materials using the electron storage ring Metrology Light Source (MLS) as a broadband synchrotron radiation source. For verifying high-resolution imaging and nano-FTIR spectroscopy we performed scans across nanoscale Si-based surface structures. The obtained results demonstrate that a spatial resolution below 40 nm can be achieved, despite the use of a radiation source with an extremely broad emission spectrum. This approach allows not only for the collection of optical information but also enables the acquisition of nearfield spectral data in the mid-infrared range. The high sensitivity for spectroscopic material discrimination using synchrotron radiation is presented by recording near-field spectra from thin films composed of different materials used in semiconductor technology, such as SiO 2 , SiC, Si x N y , and TiO 2 . ©2014 Optical Society of AmericaOCIS codes: (120.0120) Instrumentation, measurement, and metrology; (180.4243) Near-field microscopy; (240.0240) Optics at surfaces; (300.0300) Spectroscopy; (310.6860) Thin films, optical properties. 1248-1262 (2014). 5. S. Kawata and Y. Inouye, "Scanning probe optical microscopy using a metallic probe tip," Ultramicroscopy 57(2-3), 313-317 (1995). 6. F. Zenhausern, Y. Martin, and H. K. Wickramasinghe, "Scanning interferometric apertureless microscopy: References and linksOptical imaging at 10 angstrom resolution," Science 269(5227), 1083-1085 (1995). 7. R. Bachelot, P. Gleyzes, and A. C. Boccara, "Near-field optical microscope based on local perturbation of a diffraction spot," Opt. Lett. 20(18), 1924-1926 (1995). 8. B. Knoll and F. Keilmann, "Near-field probing of vibrational absorption for chemical microscopy," Nature 399(6732), 134-137 (1999 Helm, "Anisotropy contrast in phonon-enhanced apertureless near-field microscopy using a free-electron laser," Phys. Rev. Lett.

To address the integration of the high-mobility Ge/III-V MOSFET, a common gate stack (CGS) solution is proposed for the first time and demonstrated on Ge and InGaAs channels with combined hole and electron field-effect mobility values up to 400cm²/eV-s and 1300cm²/eV-s. Based on the duality found on the InGaAs/Ge MOS system, this approach aims to integrate the InGaAs/Ge MOSFET processes for high performance CMOS applications with an emphasis on progressive EOT scaling.

We present atom probe analysis of 40nm wide SiGe fins embedded in SiO and discuss the root cause of artefacts observed in the reconstructed data. Additionally, we propose a simple data treatment routine, relying on complementary transmission electron microscopy analysis, to improve compositional analysis of the embedded SiGe fins. Using field evaporation simulations, we show that for high oxide to fin width ratios the difference in evaporation field thresholds between SiGe and SiO results in a non-hemispherical emitter shape with a negative curvature in the direction across, but not along the fin. This peculiar emitter shape leads to severe local variations in radius and hence in magnification across the emitter apex causing ion trajectory aberrations and crossings. As shown by our experiments and simulations, this translates into unrealistic variations in the detected atom densities and faulty dimensions in the reconstructed volume, with the width of the fin being up to six-fold compressed. Rectification of the faulty dimensions and density variations in the SiGe fin was demonstrated with our dedicated data treatment routine.

Comments & Info.csv Data_BinSi Ref.csv Data_PinSi_Ref.csv Data_S1_InROI.csv Data_S1_NextToROI.csv Data_S2_InROI.csv Data_S2_NextToROI.csv Data_S3_NextToROI.csv Data_S3_P-template_InROI.csv Data_S3_P-template_NextToROI.csv Depths.csv SIMS data for: • phosphorus d-layer • boron d-layer • boron with locking d-layer