Effects of n-type doping of Al0.82In0.18N/GaN heterostructures on the conduction band (CB) profile have been investigated. Doping concentrations well above 1019 cm−3 are required to reduce the large barriers in the CB. Experimentally, Si- and Ge donor species are compared for n-type doping during metalorganic vapor phase epitaxy. For Si doping, we find substantial interface resistivity that will strongly contribute to total device resistivity. Doping of AlInN is limited by either the onset of a self-compensation mechanism (Si) or structural degradation of the AlInN (Ge). Only by Ge doping, purely ohmic behavior of periodic AlInN/GaN layer stacks could be realized.

We report on the realization of highly conductive and highly reflective n-type AlInN/GaN distributed Bragg reflectors (DBR) for use in vertical cavity surface emitters in a metalorganic vapor phase epitaxy process. While Ge-doping enables low-resistive n-type GaN/AlInN/GaN heterostructures, very high Ge doping levels compromise maximum optical reflectivities of DBRs. Simulations of the Bragg mirror's reflectivities together with structural analysis by X-ray diffraction reveal an increased absorption within the doped AlInN layers and interface roughening as major causes for the observed reduction of the optical reflectivity. By adjusting the Ge doping level in the AlInN layers, this structural degradation was minimized and highly conductive, 45-fold AlInN/GaN DBR structures with a maximum reflectivity of 99 % and vertical specific resistance of 5x10-4 Ωcm2 were realized.