Constitutive models for SnAgCu solder alloys are of great interest at the present. Commonly, constitutive models that have been successfully used in the past for Sn-Pb solders are used to describe the behavior of SnAgCu solder alloys. Two issues in the modeling of lead-free solders demand careful attention: 1) Lead-free solders show significantly different creep strain evolution with time, stress and temperature, and the assumption of evolution to steady state creep nearly instantaneously may not be valid in SnAgCu alloys and 2) Models derived from bulk sample test data may not be reliable when predicting deformation behavior at the solder interconnection level for lead-free solders due to the differences in the inherent microstructures at these different scales. In addition, the building of valid constitutive models from test data derived from tests on solder joints must de-convolute the effects of joint geometry and its influence on stress heterogeneity. Such issues have often received insufficient attention in prior constitutive modeling efforts. In this study all of the above issues are addressed in developing constitutive models of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys, which represent the extremes of Ag composition that have been mooted at the present time. The results of monotonic testing are reported for strain rates ranging from 4.02E-6 to 2.40E-3 s 1 . The creep behavior at stress levels ranging from 7.8 to 52 MPa is also described. Both types of tests were performed at temperatures of 25 C, 75 C and 125 C. The popular Anand model and the classical time-hardening creep model are fit to the data, and the experimentally obtained model parameters are reported. The test data are compared against other reported data in the literature and conclusions are drawn on the plausible sources of error in the data reported in the prior literature.

Constitutive models for SnAgCu solder alloys are of great interest at the present. Commonly, constitutive models that have been successfully used in the past for Sn-Pb solders are used to describe the behavior of SnAgCu solder alloys. Two issues in the modeling of lead-free solders demand careful attention: (i) Lead-free solders show significantly different creep strain evolution with time, stress and temperature, and the assumption of evolution to steady state creep nearly instantaneously may not be valid in SnAgCu alloys and (ii) Models derived from bulk sample test data may not be reliable when predicting deformation behavior at the solder interconnection level for lead-free solders due to the differences in the inherent microstructures at these different scales. In addition, the building of valid constitutive models from test data derived from tests on solder joints must deconvolute the effects of joint geometry and its influence on stress heterogeneity. Such issues have often received insufficient attention in prior constitutive modeling efforts. In this study all of the above issues are addressed in developing constitutive models of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys, which represent the extremes of Ag composition that have been mooted at the present time. The results of monotonic testing are reported for strain rates ranging from 4.02E-6 to 2.40E-3 s−1. The creep behavior at stress levels ranging from 7.8 to 52 MPa are also described. Both types of tests were performed at temperatures of 25°C, 75°C and 125°C. The popular Anand model and the classical time-hardening creep model are fit to the data and the experimentally obtained model parameters are reported. The test data are compared against other reported data in the literature and conclusions are drawn on the plausible sources of error in the data reported in the prior literature.

No abstract

Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn–Pb solder alloys together with empirical fatigue life models such as the Coffin–Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn–Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection. The model is shown to be similar to well accepted cohesive zone models in its theoretical development and application and is anticipated to be computationally more efficient compared to cohesive zone models in a finite element setting. The approach goes beyond empirical modeling in accurately predicting crack trajectories and is validated against experiments performed on lead-free as well as Sn–Pb solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique.

In heterogeneous micro structures that include several grains, secondary phases and interfaces, cracks are known to initiate and grow through different mechanisms. The failure processes however are not well understood. Solder alloys in general, and Pb-free alloys in particular possess complex, heterogeneous microstructures that evolve in fracture in ways that are challenging to model. Often, underlying a fracture observed under a microscope is a hierarchy of fracture-related phenomenon from atomic to macro length-scales. In this paper we develop a failure model inspired by information theory and continuum thermodynamics to capture the multiscale fracture processes in solder joints. We systematically develop measures of dissipation from continuum thermodynamics for materials described by J2 plasticity theory. Crack growth is known to be dissipative and such measures are natural candidates for predicting failure within a mechanics framework. The dissipation estimates, multiple fracture mechanisms and the notions of continuity, monotonicity and composition borrowed from information theory suggest a single model as being capable of predicting both ductile and brittle types of failures.