In this paper, we investigate the tradeoff between power-usage and stiffness to find an in-chip device layer micro-oven design with optimal yield. A variety of micro-ovenized double-ended tuning forks (DETFs) anchored via a serpentine heater or micro-oven are fabricated in an ultra-clean vacuum seal encapsulation process. The micro-ovens contain beams of varying lengths, widths, and thicknesses. We compare the power required to raise the microovens to a fixed temperature and the yield of the devices. These results are the first report of yield statistics for in-chip device-layer ovenized devices. We show that a serpentine micro-oven located in the device layer of an encapsulated device with a thermal conductance of 0.17 mW/ o C and a 25% yield, has 4X improvement over the power required for earlier, stiffer micro-oven designs.