A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi lowtemperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at 130 o C. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at 180 o C for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as 9 mΩ.

This paper presents a novel on-chip antenna with quintuple band so that it will be able to operate in the ultra wideband (UWB). The antenna consists of two trapezoidal slots which are symmetrical in the patch with coaxial feeding. The two types of substrate we have investigated for antenna design are the HRS and Pyrex glass wafers.The possibility of on-chip antenna integration with circuitry is shown. As a result, a novel multi-band antenna structure for sensor network is proposed for a quintuple band application; C-band and X-band.