No abstract

In this paper, we introduce a method to efficiently use a high-energy pulsed 1.7 ps HiLASE Perla laser system for two beam interference patterning. The newly developed method of large-beam interference patterning permits the production of micro and sub-micron sized features on a treated surface with increased processing throughputs by enlarging the interference area. The limits for beam enlarging are explained and calculated for the used laser source. The formation of a variety of surface micro and nanostructures and their combinations are reported on stainless steel, invar, and tungsten with the maximum fabrication speed of 206 cm2/min. The wettability of selected hierarchical structures combining interference patterns with 2.6 µm periodicity and the nanoscale surface structures on top were analyzed showing superhydrophobic behavior with contact angles of 164°, 156°, and 150° in the case of stainless steel, invar, and tungsten, respectively.

Nanostructuring and microstructuring approaches frequently used in microelectronics manufacturing, such as electron beam lithography or nanoimprint lithography, are considerably slow. In order to reduce processing time, laser patterning methods based on interference of multiple beams have been developed. Within one laser pulse, a significant part of an irradiated area on a sample surface is patterned with desired micro-or submicrostructures. Nowadays, interference patterning goes beyond periodic lines and dots. Controlling the number of interfering beams, orientation of polarization vectors, relative phase shift, and the beam angle of incidence allows to customize the intensity distribution on the sample surface. Simulations of various interference patterns were calculated and verified on CMOS camera using 1030 nm laser diode. Based on these results, dot and line-like interference patterns were directly imprinted on the surface of carbon fiber reinforced polyether ether ketone plate by 1.8 ps, 11 mJ laser pulses at 1030 nm.