We present a model for the behavioural description of resonant cantilevers for chemical sensing. This model is well suited to be implemented in an analog behavioural description language like Verilog-A to enable simulations of the cantilever devices together with integrated electronic circuits. The model is based on the assumption that the resonant cantilever can be described as a plate, with three free and one clamped end; we suppose the damping force acting on the structure is due to air friction and to the viscoelastic behaviour of the polymer used as sensitive layer. We have validated the model by modal FEM analysis (ANSYS TM ) and by measurements with a dynamic signal analyzer (DSA).Simulations with the Spectre TM circuit simulator, including the cantilever device and integrated feedback electronics, have been carried out and show good agreement with the measured transient behaviour of the cantilever devices.

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In this work a combined experimental/numerical approach to describe the thermo-mechanical behavior of power devices under repetitive power pulsing is presented. Stress tests have been carried out on power DMOS implemented in Smart Power BCD technology with different Back-End Of Line (BEOL) schemes, including, for the first time, full Copper. Mechanical laboratory nano-indentation tests have been used to determine constituent properties of the metal layers. Thermo-mechanical 3D FEM modeling has been used to simulate a multi-cycle thermal loading of a whole power device with its package. Results from simulation have been qualitatively compared to experimental results. © 2013 IEEE