This paper presents the results of an investigation of the influence of soft baking temperature on the lithographic performance of the negative photoresist SU-8. The work was initiated in order to obtain a lithographic resolution suitable for integration of diffractive optical components for near-infrared wavelengths. The study was carried out on 40 µm SU-8 layers on thermally oxidized silicon wafers, a widespread platform for integration of microfluidic systems and waveguides. A series of experiments covering soft bake temperatures in the range 65–115 °C were performed under otherwise identical processing conditions. The influence of the soft bake temperature on polymerization temperature as well as cracking, lithographic resolution and hardness of the resist was investigated. The kinetics of the polymerization process were observed to change with soft bake temperature, leading to changes in sensitivity and contrast of the resist, as well as changes in the material strength of the developed structures. Soft baking at 65 °C proved superior with respect to all the inspected properties, providing a sample showing full resolution of 3.8 µm wide trenches and no stress-related cracking.

The authors present the fabrication and characterization of an integrated optical readout scheme based on single-mode waveguides for cantilever-based sensors. The cantilever bending is read out by monitoring changes in the optical intensity of light transmitted through the cantilever that also acts as a waveguide. The complete system is fabricated in the photosensitive polymer SU-8. They show theoretical calculations on the expected sensitivity both when operated in air and liquid and compare these with experimental characterization of the system in air where the cantilever is deflected mechanically. The experimental results compare well with the results obtained from the theoretical calculations.

Abstract-Fabrication and optical characterization of singlemode polymeric embedded waveguides are performed. A specific material combination (SU-8 2005 as core and the modified SU-8 mr-L 6050XP as cladding) is chosen in order to obtain a small refractive index difference for single-mode propagation combined with the conventional fabrication method UV lithography to facilitate the integration of different types of optical detection methods on lab-on-a-chip systems. We analyze the behavior of the refractive index and carefully observe how the value of the refractive index can be tailored during processing. We show that we can fabricate waveguides with an index difference in the order of 10 −3 , where both the core material and the cladding material are based on SU-8. The refractive index measurements are performed on thin polymeric films, while further optical characterizations are performed on waveguides with a height of 4.5 µm. We study the mode profiles of these waveguides and confirm that only the fundamental mode is excited. We also study the absorption spectra of the material in the wavelength range 800-1600 nm combined with cut-back measurements. We find that the waveguides have a propagation loss of 0.2-3 dB/cm in this wavelength range.

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