Articles you may be interested inMorphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermalstress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications J. Appl. Phys. Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory J. Appl. Phys.

Articles you may be interested inMorphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory J. Appl. Phys.Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure

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