We demonstrate a vertical (<1°departure) and smooth (2.0 nm root mean square line-edge roughness (LER)) etch by chemically assisted Ar ion beam etching (CAIBE) in Cl 2 chemistry that is suitable for forming laser diode (LD) facets on nonpolar and semipolar oriented III-nitride devices. The etch profiles were achieved with photoresist masks and optimized CAIBE chamber conditions including the platen tilt angle and Cl 2 flow rate. Co-loaded studies showed similar etch rates of ∼60 nm min −1 for 2021 , 2021 , ( ¯¯) ( ¯) and m-plane orientations. The etched surfaces of LD facets on these orientations are chemically dissimilar (Ga-rich versus N-rich), but were visually indistinguishable, thus confirming the negligible orientation dependence of the etch. Continuous-wave blue LDs were fabricated on the semipolar 2021 ( ¯¯) plane to compare CAIBE and reactive ion etch (RIE) facet processes. The CAIBE process resulted in LDs with lower threshold current densities due to reduced parasitic mirror loss compared with the RIE process. The LER, degree of verticality, and model of the 1D vertical laser mode were used to calculate a maximum uncoated facet reflection of 17% (94% of the nominal) for the CAIBE facet. The results demonstrate the suitability of CAIBE for forming high quality facets for high performance nonpolar and semipolar III-N LDs.

Devices grown on nonpolar and semipolar planes of GaN offer key performance advantages over devices grown on the conventional c-plane, including reduced polarization fields. This allows for a wider design space on semipolar planes for light emitting diodes (LEDs) to address the problem of efficiency droop at high current densities. LED structures with very thick (10–100 nm) InGaN single-quantum-well/double heterostructure active regions were grown using conventional metal organic chemical vapor deposition on semipolar (303¯1¯) free-standing GaN substrates and processed and packaged using conventional techniques. Simulated band diagrams showed reduced polarization fields on the (303¯1¯) plane. The calculated critical thickness for misfit dislocation formation is higher on the (303¯1¯) plane than on other semipolar planes, such as (202¯1¯), allowing for thicker active regions than our previous work to further reduce droop. The higher critical thickness was confirmed with defect characterization via cathodoluminescence. A trend is demonstrated in lower efficiency droop for devices with thicker active regions. Thermal droop characteristics of these devices are also presented. These observed results were utilized to demonstrate over 1 W of output power at a current density of 1 kA/cm2 from a single 0.1 mm2 LED device.

Continuous-wave blue semipolar (202¯1¯) III-nitride laser diodes were fabricated with highly vertical, smooth, and uniform mirror facets produced by chemically assisted ion beam etching. Uniform mirror facets are a requirement for accurate experimental determination of internal laser parameters, including internal loss and injection efficiency, which were determined to be 9 cm−1 and 73%, respectively, using the cavity length dependent method. The cavity length of the uncoated devices was varied from 900 μm to 1800 μm, with threshold current densities ranging from 3 kA/cm2 to 9 kA/cm2 and threshold voltages ranging from 5.5 V to 7 V. The experimentally determined internal loss was found to be in good agreement with a calculated value of 9.5 cm−1 using a 1D mode solver. The loss in each layer was calculated and in light of the analysis several modifications to the laser design are proposed.

Semipolar (202¯1) plane InxGa1−xN quantum wells (QWs) of varying alloy composition were studied by time-resolved photoluminescence. A large difference in effective radiative lifetimes, from sub-ns for x=0.11 to ∼30 ns for x≈0.35 was found. This effect is attributed to different properties of carrier localization. In low In content QWs, recombination at extended states with short recombination times is prevalent. In QWs with a high In content, the lifetimes are increased by localization of electrons and holes at separate sites. The zigzag shape of the QW interfaces and the resulting in-plane electric field are proposed as the cause for the separate electron and hole localization.

The benefits of utilizing transparent conductive oxide on top of a thin p-GaN layer for continuous-wave (CW) operation of blue laser diodes (LDs) were investigated. A very low operating voltage of 5.35 V at 10 kA/cm was obtained for LDs with 250 nm thick p-GaN compared to 7.3 V for LDs with conventional 650 nm thick p-GaN. An improved thermal performance was also observed for the thin p-GaN samples resulting in a 40% increase in peak light output power and a 32% decrease in surface temperature. Finally, a tradeoff was demonstrated between low operating voltage and increased optical modal loss in the indium tin oxide (ITO) with thinner p-GaN. LDs lasing at 445 nm with 150 nm thick p-GaN had an excess modal loss while LDs with an optimal 250 nm thick p-GaN resulted in optical output power of 1.1 W per facet without facet coatings and a wall-plug efficiency of 15%.