Microelectromechanical systems (MEMS) gyroscopes are widely used, e.g., in modern automotive and consumer applications, and require signal stability and accuracy in rather harsh environmental conditions. In many use cases, device reliability must be guaranteed under large external loads at high frequencies. The sensitivity of the sensor to such external loads depends strongly on the damping, or rather quality factor, of the high-frequency mechanical modes of the structure. In this paper, we investigate the influence of thermoelastic damping on several high-frequency modes by comparing finite element simulations with measurements of the quality factor in an application-relevant temperature range. We measure the quality factors over different temperatures in vacuum, to extract the relevant thermoelastic material parameters of the polycrystalline MEMS device. Our simulation results show a good agreement with the measured quantities, therefore proving the applicability of our method for predictive purposes in the MEMS design process. Overall, we are able to uniquely identify the thermoelastic effects and show their significance for the damping of the high-frequency modes of an industrial MEMS gyroscope. Our approach is generic and therefore easily applicable to any mechanical structure with many possible applications in nano- and micromechanical systems.

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the last decade, the MEMS community has experienced immense progress in the science and technology of miniaturization, as well as increasing technical maturity and commercialization of ever smarter products encompassing embedded artificial intelligence and wireless connectivity to the Internet-of-Things. Since 2020, the conference is sponsored by the IEEE MEMS Technical Community, a new body within the IEEE dedicated to supporting and developing our MEMS community. This Conference brings together annually the international MEMS community consisting of top players in academia and industry by providing them with the latest results on every aspect of MEMS. The organizers this year made a special effort to attract technical contributions from industry, also showcased in the Industry Workshop. We hope that you will enjoy the presentations by our accomplished invited plenary speakers and stringently selected contributed oral and poster presentations.We would like to express our sincerest gratitude to all the authors who submitted their abstracts. Their high-quality work serves as the foundation for the success of this conference. A total of 314 papers out of 636 submitted abstracts were carefully selected by 47 experts comprising the Technical Program Committee (TPC) using a well-established double-blind review process that ensures scientific quality as the sole selection criterion. The TPC comprises academic and industrial members, with equal representation from three regional divisions: the Americas, Europe & Africa, and Asia & Oceania. To allow for more focused and careful deliberation, the actual abstract review process divided the overall TPC into eight sub-committees, each with six members to evaluate and rate each abstract. We are grateful to all TPC members who volunteered their valuable time, including participation in a two-day virtual meeting last October, for paper selection.The conference arranges presentation of accepted papers in a mixed single/parallel session format with 4 invited plenary, 70 oral, 238 poster presentations, and 15 open poster presentations. In addition, the TPC collectively nominated, based on quality, abstract submissions as finalists for the Outstanding Student Paper Awards and images for the Art in Microtechnology prize. These awards aim to recognize excellence amongst work presented by students and will be announced in a special ceremony to conclude the conference late Thursday morning.We gratefully acknowledge the industrial support groups, exhibitors, and benefactors for their contributions to this conference. The dedicated and relentless effort of Ms. Sara Stearns and her team at PMMI in managing this conference is highly appreciated.In closing, we hope you enjoy the networking, technical presentations, exhibition booths, and events of the 2023 IEEE International MEMS Conference this week in Munich!