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Power electronic modules are exhibiting ever increasing power density as a result of compound semiconductor devices being placed in packages of decreasing size. This has led, in turn, to higher volumetric heat generation, which is driving the development of advanced thermal management approaches, including integration of single and two-phase microchannel coolers into the power electronics package. Reliable integration and operation of these coolers is essential for maintaining the performance and reliability of the power electronic system as a whole. This paper will present models for the critical failure mechanisms in microchannel coolers, including erosion/corrosion and cooler fracture.

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