To meet the design requirements, different types of defects are often machined on the surface of fatigue components. Local stress concentration formed at the notch accelerates the initiation of fatigue crack, therefore greatly shortens the service lives of such components. Based on the theory of continuous damage mechanics and the principle of irreversible thermodynamics, the damage evolution model of low cycle fatigue is investigated. By programming the damage evolution model as a UMAT subroutine and coupling it to ABAQUS, the fatigue damage and crack initiation life of notched P92 steel samples under specific loads are simulated, and the crack initiation location is determined. Furthermore, the damage evolution and crack initiation sensitivity of notch morphology are considered. The results show that the crack initiation occurs easily in the notch root where the damage reaches the maximum and the plastic strain accumulates most quickly under cyclic loading. The fatigue damage accumulates slowly at the initial stage, but the damage accumulates rapidly after the cumulative damage reaches a critical value. The fatigue damage evolution and fatigue initiation life are very sensitive to the notch morphology parameters. The notch morphologies need to be analyzed carefully, to improve the fatigue life of the notched samples.

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Limited by the mechanical properties of materials, silicon (Si) carbide insulated gate bipolar transistor (IGBT) can no longer meet the requirements of high power and high frequency electronic devices. Silicon carbide (SiC) IGBT, represented by SiC MOSFET, combines the excellent performance of SiC materials and IGBT devices, and becomes an ideal device for high-frequency and high-temperature electronic devices. Even so, the thermal fatigue failure of SiC IGBT, which directly determines its application and promotion, is a problem worthy of attention. In this study, the thermal fatigue behavior of SiC-IGBT under cyclic temperature cycles was investigated by finite element method. The finite element thermomechanical model was established, and stress-strain distribution and creep characteristics of the SnAgCu solder layer were obtained. The thermal fatigue life of the solder was predicted by the creep, shear strain and energy model respectively, and the failure position and factor of failure were discussed.