Beyond fifth generation (5G) communication systems aim towards data rates in the tera bits per second range, with improved and flexible coverage options, introducing many new technological challenges in the fields of network architecture, signal processing, and radio frequency front-ends. One option is to move towards cell-free, or distributed massive Multiple-Input Multiple-Output (MIMO) network architectures and highly integrated front-end solutions. This paper presents an outlook on beyond 5G distributed massive MIMO communication systems, the signal processing, characterisation and simulation challenges, and an overview of the state of the art in millimetre wave antennas and electronics.

No abstract

We propose a silicon on-Chip-in-Package antenna design featuring a simulated radiation efficiency of > 70% and an S11 matching better than −10 dB in the 112-125 GHz frequency range. High radiation performance is achieved by: (i) thinning the silicon substrate down to 100 µm through wafer-level grinding; (ii) embedding the IC in-between two PCBs, one of which forms an electromagnetic bandgap structure that attenuates the EM leakage inside the silicon substrate. Furthermore, since the die-embedding concept employs the gap-waveguide packaging technology, a universal contactless waveguide interconnect is realized between the IC and the radiating gap waveguide in the package. This will also enable modular antenna designs.