Metasurfaces can be programmed for a spatial transformation of the wavefront, thus allowing parallel optical signal processing on-chip within an ultracompact dimension. On-chip metasurfaces have been implemented with two-dimensional periodic structures, however, their inherent scattering loss limits their large-scale implementation. The scattering can be minimized in single layer high-contrast transmitarray (HCTA) metasurface. Here we demonstrate a one-dimensional HCTA based lens defined on a standard silicon-on-insulator substrate, with its high transmission (<1 dB loss) maintained over a 200 nm bandwidth. Three layers of the HCTAs are cascaded for demonstrating meta-system functionalities of Fourier transformation and differentiation. The meta-system design holds potential for realizing on-chip transformation optics, mathematical operations and spectrometers, with applications in areas of imaging, sensing and quantum information processing.

Sufficiently large depletion region for photocarrier generation and separation is a key factor for two-dimensional material optoelectronic devices, but few device configurations has been explored for a deterministic control of a space charge region area in graphene with convincing scalability. Here we investigate a graphene-silicon p-i-n photodiode defined in a foundry processed planar photonic crystal waveguide structure, achieving visible -near-infrared, zero-bias and ultrafast photodetection. Graphene is electrically contacting to the wide intrinsic region of silicon and extended to the p an n doped region, functioning as the primary photocarrier conducting channel for electronic gain. Graphene significantly improves the device speed through ultrafast out-of-plane interfacial carrier transfer and the following in-plane built-in electric field assisted carrier collection. More than 50 dB converted signal-to-noise ratio at 40 GHz has been demonstrated under zero bias voltage, with quantum efficiency could be further amplified by hot carrier gain on graphene-i Si interface and avalanche process on graphene-doped Si interface. With the device architecture fully defined by nanomanufactured substrate, this study is the first demonstration of post-fabrication-free two-dimensional material active silicon photonic devices.

The primary mechanism of optical memoristive devices relies on phase transitions between amorphous and crystalline states. The slow or energy‐hungry amorphous–crystalline transitions in optical phase‐change materials are detrimental to the scalability and performance of devices. Leveraging an integrated photonic platform, nonvolatile and reversible switching between two layered structures of indium selenide (In2Se3) triggered by a single nanosecond pulse is demonstrated. The high‐resolution pair distribution function reveals the detailed atomistic transition pathways between the layered structures. With interlayer “shear glide” and isosymmetric phase transition, switching between the α‐ and β‐structural states contains low re‐configurational entropy, allowing reversible switching between layered structures. Broadband refractive index contrast, optical transparency, and volumetric effect in the crystalline–crystalline phase transition are experimentally characterized in molecular‐beam‐epitaxy‐grown thin films and compared to ab initio calculations. The nonlinear resonator transmission spectra measure of incremental linear loss rate of 3.3 GHz, introduced by a 1.5 µm‐long In2Se3‐covered layer, resulted from the combinations of material absorption and scattering.

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Atomic vacancies related to structural disorder and doping variation influence carrier transport in monolayer transition-metal dichalcogenide devices. Here, we investigate the effect of hydrogen plasma exposure (HPE) on monolayer MoS2 field-effect transistors (FETs). We observe that a 1% increase in sulfur vacancy after HPE results in incremental 0.06 eV of the Schottky barrier. Short-range scattering from the sulfur vacancies reduces the carrier mobility of monolayer MoS2 by 2 orders of magnitude. Despite the defects and grain boundaries formed during the chemical vapor deposition and transferring process, the surface desulfurization induced by the proton exposure and thermally accelerated oxidation can be blocked by monolayer graphene cladding with a van der Waals contact distance of 2.5 Å. The material-level study indicates a promising route for a low-cost and robust fabrication of smart sensor circuits on a monolithic MoS2 wafer, where the bare MoS2 FETs can serve as proton sensors, with their electronic readout processed by a logic circuit of graphene-protected pristine FETs with a high on/off ratio.