This study presents the additive manufacture of objects using mass-functionalized photo-resins, which are additively photopolymerized using the laser stereolithography technique. The mass functionalization is based on the incorporation of copper nanowires used as fillers at different concentrations. Cylindrical and tensile test probes are designed and manufactured in a layer-by-layer approach using a low-cost laser stereolithography system working with a layer thickness of 100 µ m . The morphological, mechanical, thermal and chemical results help to show the viability and potential that this combination of mass-functionalized resins and technological processes may have in the near future, once key challenges are solved. Finally, some potential applications are also discussed.
glass system G Naga Raju, N Ch Ramesh, P Naresh et al.
IntroductionThe manufacturing industry generally uses one-point cutting tools and machine-tools in its production processes, which rapidly deteriorate under severe operating conditions, causing millions of losses that can account for up to 25% of production costs [1], so the application of coatings on the surface of cutting tools has had a constant development during the last decades, optimizing production without significantly increasing costs and especially improving surface properties such as wearing resistance, lower coefficient of friction, resistance to oxidation, among others [2]. According to the above, an alternative technique of surface modification of metallic materials capable of achieving unique physicochemical properties, which by traditional metallurgical methods cannot be obtained, is the three-dimensional ion implantation (3DII) of metal species [3][4][5][6][7].In the present investigation, by means of a process of manufacture by chip removal of turning of dry finishing [8,9], according to ISO 3685: 1993 [10] is analysed the behaviour of the useful half-life in service of the burin of HSS steel not modified superficial (reference) with respect to superficially treated with Ti ions.
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