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This paper details a power solution for smart grid applications to replace batteries by harvesting the electromagnetic energy from a current-carrying wire. A MEMS piezoelectromagnetic energy harvester has been fabricated using PZT screen-printing technology with a centrally-supported meandering geometry. The energy harvesting device employs a symmetric geometry to increase its power output by reducing the effects of the torsional modes and the resultant overall strain nodes in the system subsequently reduce the complexities for the electrode fabrication. The unit is modelled using COMSOL to determine mode shapes and frequency response functions. A 12.7 mm by 14.7 mm unit is fabricated by screen-printing 75 μm-thick PZT on a stainless steel substrate and then experimentally tested to validate the FEA results. Experimentally, the harvester is shown to produce 9 μW from a wire carrying 7 A while operating at a distance of 6.5 mm from the wire. The design of the current work results in a greater normalized power density than other MEMS based piezoelectromagnetic devices and shows great potential relative to larger devices that use bulk or thin film piezoelectrics.

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The design and processing of vibrational energy harvester based on screen-printed piezoelectric lead zirconate titanate (Pb(ZrxTi1-x)O3 (PZT)) are described here. Two different structures, a simple cantilever and a complex zigzag geometry made of PZT layer sandwiched between gold electrodes and supported on a metallic stainless steel substrate have been successfully fabricated by screen printing thick film technique. Compared to bulk PZT ceramics, the main limiting features at different scales are porosity, interfaces, and bending issues. The microstructural analysis of the interfaces in the cantilever has highlighted the formation of an interface between the substrate and the bottom electrode which ensures cohesion of the structure but can limit its dynamic. Bending has shown to be dependent on the thickness of the active piezoelectric layer. Dielectric and electromechanical characterizations performed on multilayers, bulk ceramics, and free-standing screen-printed disks are compared and discussed on the basis of interface issues.

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