The intracortical neural interface (INI) could be a key component of brain machine interfaces (BMI), devices which offer the possibility of restored physiological neurological functionality for patients suffering from severe trauma to the central or peripheral nervous system. Unfortunately the main components of the INI, microelectrodes, have not shown appropriate long-term reliability due to multiple biological, material, and mechanical issues. Silicon carbide (SiC) is a semiconductor that is completely chemically inert within the physiological environment and can be micromachined using the same methods as with Si microdevices. We are proposing that a SiC material system may provide the improved longevity and reliability for INI devices. The design, fabrication, and preliminary electrical and electrochemical testing of an all-SiC prototype microelectrode array based on 4H-SiC, with an amorphous silicon carbide (a-SiC) insulator, is described. The fabrication of the planar microelectrode was performed utilizing a series of conventional micromachining steps. Preliminary electrochemical data are presented which show that these prototype electrodes display suitable performance.