No abstract

Cu-droplet losses in slags are an important problem in Cu-industry, limiting the metal recovery. An important cause responsible for the entrainment of copper droplet losses in slags is their sticking behaviour to spinel solids. In the present study, the interaction between spinel solids and Cu-droplets is investigated in an industrially relevant slag system (PbO-CaO-SiO-Cu 2 O-Al 2 O 3-FeO-ZnO) using two complementary experimental setups. Firstly the influence of the sedimentation time is studied and secondly the presence of entrained (sticking) droplets is studied as a function of height in the slag layer. Based on the experimental results, a mechanism that explains the sticking Cu-droplets is proposed. Finally, a model describing the sedimentation of sticking and non-sticking droplets is formulated based on the experimental data.

Metal droplet losses in slags are an important issue in copper industry. One significant aspect that promotes the entrainment of metal droplets in the slag is their attachment to spinel solids. In the present study, the wetting behaviour of copper alloys on spinel substrates has been investigated in the presence and absence of a slag phase. At first, the attachment was investigated using a synthetic slag containing spinel particles. Microstructural analysis of quenched slag reveals the presence of microdroplets sticking onto a surface of the spinel particles. Second, the metal–spinel interaction was investigated using the sessile drop technique. Wetting angle measurements were performed between Cu–Ag alloys and MgAl2O4 substrates. A non-wetting behaviour between the alloys and substrates was observed. The results suggest that the oxygen partial pressure and the amount of Ag in the alloy both influence the wetting behaviour.

No abstract