In this work, the electroplating of copper on an aluminum substrate without electrochemical surface treatment was investigated. Electroplating of copper on aluminum substrate was prepared from copper sulfate electrolyte bath with various current densities 1 mA/cm², 3 mA/cm², 10 mA/cm², and 40 mA/cm². The effects of current density on the samples properties were characterized using a different technique. The surface morphology, crystallographic orientation, and corrosion resistance of the Copper film were analyzed using a scanning electron microscope, energy dispersive spectroscopy (SEM-EDS), X-ray diffractometer (XRD), and potentiostat. The samples' surface morphology is changed with different current densities because nucleation is driven by transferring the copper ion rate onto the aluminum substrate. The Cu-10 sample exhibits (111) peak higher and the best corrosion resistance than other samples. Moreover, Cu-1 samples have shifted to positive corrosion voltage (Ecorr) than the other samples.

Austenitic Stainless Steel has been being used in many fields. Austenitic Stainless Steel which has composition 19 wt%Cr–7wt%Ni has been subjected to heat treatment. One of the many heat treatments applicable to improve the corrosion resistance is the full annealing method. This material subject to full annealing method with rapid quenching in various annealing temperatures; 1010°C, 1065°C, and 1120°C. Potentiodynamic curves before and after heat treatment were acquired to elaborate the electrochemical behavior of this austenitic stainless steel. Besides the corrosion rate, the structure of the austenitic stainless steel has been characterized using x-ray diffraction (XRD) to study the structure. The results showed the full annealing modified the structure and the electrochemical behavior of the austenitic stainless steel.

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