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With the optimization of sulfate-free cleaning the issue of haze under pellicle was almost eliminated. In consequence, current reasons for mask repelliclization needs are moving from pattern issues to more gross problems on back glass. Moreover, the longer life of photomasks allows a new problem to appear as growing defects on back glass, commonly ascribed to environmental conditions at user's site. The commonality of these problems is being independent on mask complexity and substrate. In order to avoid the criticalities of pellicle removal and cleaning treatment as well as the cost of necessary inspection after new pellicle application, the best solution is cleaning only the backside of the mask, provided that integrity of pellicle and pattern on front side are preserved In this article we present the results obtained by the use of the Mask cleaner DE050019 ™ on several cases. The efficiency of the treatment was assessed in terms if removal capability on different kinds of contaminations, either from use or mask aging. Pattern inspections were conducted in order to assess ESD robustness. Ionic residues were checked by IC aimed to compare with standard cleanings. This methodology demonstrated to be capable of maintaining a Particle Removal Efficiency>97% on all kinds of contaminations, without any damage to pellicle or harm to patterns, still maintaining residual ions at the same level as after cleaning by standard tools.

Within the frame of the European R&D project the so called "HYMNE" project, lead by STM, advanced vacuum decontamination processes had been demonstrated to be efficient on wafer substrates in order to remove airborne molecular contamination (moisture, VOC..), to avoid crystalline defects after dry etching process and to improve yield for sub 90 nm technologies.Further to these significant results on wafers, a pool of partners investigated new methods and processes based on vacuum technology for photomask decontamination. These studies were carried out in the frame of the European R&D CRYSTAL project, focusing on photomask defect reduction.Today, vacuum process is not very widespread in photomask environment: in fab environment nor in mask manufacturing cycle. However such vacuum substrate decontamination could be also efficiently applied in order to reduce AMC contamination, which is one of the root causes of haze and crystalline defects. In this paper, we report for the first time, vacuum process investigations on pellicled photomasks that could be applied in fab environment, as well as vacuum process investigations on patterned blank that could be integrated into mask manufacturing cycle.First, vacuum process had been investigated on pellicled photomasks, including parameter influences. Goal is to renew and replace the environment under the pellicle by clean environment. During the process, specific care has to be taken on pellicle behavior under vacuum. The challenge is indeed to manage the pellicle during the vacuum process without damaging it, especially after several decontamination cycles. Finally, repeatability tests have also been successfully carried out and will be reported.We also report advanced vacuum process on patterned blank that could be integrated into mask manufacturing flow. Such procedure is an efficient complementary process in order to outgas contaminants from photomasks, and in order to reduce AMC residues (especially sulfate) in mask manufacturing cycle. Experimental results will be reported.Integration of such vacuum decontamination process during photomask lifetime could be considered.

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