SUMMARYThis paper is devoted to the numerical analysis of bidimensional bonded lap joints. For this purpose, the stress singularities occurring at the intersections of the adherend-adhesive interfaces with the free edges are first investigated and a method for computing both the order and the intensity factor ofthese singularities is described briefly. After that, a simplified model, in which the adhesive domain is reduced to a line, is derived by using an asymptotic expansion method. Then, assuming that the assembly debonding is produced by a macro-crack propagation in the adhesive, the associated energy release rate is computed. Finally, a homogenization technique is used in order to take into account a preliminary adhesive damage consisting of periodic micro-cracks. Sorne numerical results are presented.
The finite element treatment of boundary singularities in elliptic problems has demanded that special techniques be developed. Many of these use some form of singular element in the neighborhood of a singular point.For a homogeneous se-ond-order problem, defined in a domain with a polygonal boundary. we studied three cases with different singularity orders. Some results about the accuracy of the solution are presented. Numerical results have been obtained using Akin singular triangular elements with three and six nodes and quadrilateral elements having four and eight nodes. The behavior of the gradient in each of these elements is also analyzed. However, these elements arc not completely satisfactory, so that an alternative technique using curved isoparametric elements is given here. The results obtained with the two methods ar: compared. Conclusions about numerical accuracy of each method, the order of integration and the simplicity of application arc made.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.