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System in Package(SiP) includes technologies ofMulti-chip Module(MCM), Multi-chip Package(MCP), stacked die, Package on Package(PoP), Package in Package(PiP) and Embedded substrate. While Au wire bonding technology is commonly used as current SIP interconnection solution, take Staked Die structure for example, with increasing stack die number the upper die needs longer wire bonding length for signal interconnection and results in lower electrical performance for whole system. In addition, wire bonding technology as Stacked die solution requires spacer die insertion between functional chips for bonding space and thus increases total package thickness. In order to achieve better electrical performance and reduce form factor, a new fine pitch bump technology of "Micro Bump" structure is developed with metal bump for both top and bottom chips. Micro bump structure is one of the key technologies of Trough Silicon Vias (TSV) and is used in chip to chip interconnection with the dimension of Micro bump smaller than typical flip chip bump.

Wire bonding technology has been the mainstream for stacked die packages for over five years. Yet, based on current design rule, the package body size increases with respect to the number of dice stacked in the package. Furthermore, the electrical performance is greatly dependant to the wire length. By applying Vertical Circuit Interconnection technology, VCI, the package footprint can be reduced to offer relatively smaller package size. As such, the electrical performance is enhanced due to shorter signal transmitting length.The concept of VCI technology is to replace wire bond by conductive glue, which vertically connects electric pads from strum to strum inside the die stack. Besides the standard assembly process flow, such as die attach, molding, singulation, three new process stages ─ parylene coating, laser ablation and conductive glue dispensing, are introduced to replace wire bonding after die attach process.Two test vehicles, tier stack and pyramid stack structure, were discussed in the report. Open / short test and reliability performance were examined post assembly. The packages delivered by VCI technology can be an alternative choice in small package as it offers competitive cost and performance to those by WB technology..

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