Owing to the implementation of multi-material construction methods in modern lightweight construction and the associated use of adhesive bonding technology, thermally induced relative displacements of the joining partners occur during the curing process. The resulting extremely complex thermo-chemo-mechanical stresses can influence the properties of the adhesive layers and reduce the load-bearing capacity. In this study, experiments are conducted to examine the influence of process-related thermal relative displacements on the mechanical properties of adhesives. The results show an anisotropy of the mechanical properties of the pre-deformed adhesive layers, depending on the magnitude and direction of the relative displacement.