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The aim of this research was to develop an induction diffusion brazing to obtain a sound joint between copper and aluminium. A foil interlayer was used to bond copper to aluminium at 600°C for 2 s under a bonding pressure of 9 MPa. The failure of tensile test is in the aluminium side and no failure occurs when the joint is bent to 180°. The electrical resistivity of joint is lower than that of aluminium. The interfacial intermetallic compounds layers are Cu 9 Al 4 and CuAl 2 with the total thickness of 2 μm. No voids and oxide scale are found in the joint. Heat treatment shows that induction diffusion brazing is superior to conventional flash welding to maintain electrical stability and mechanical integrity of copper to aluminium joint.

To practice the development of printed electronics, researchers need to have the access to dedicated printer of electronic materials. However, commercial printing machines require large capital investment. Direct ink write (DIW) printing on the other hand operates with single printing head and less complex system therefore is promising for tight budget projects. Herein, a DIW printing system was home-built by making modifications to a 3D printer with ready to use components. Direct pattering and minimal printing line width of 230 ± 10 µm are demonstrated using an all solution-based Ag ink. Resistive-type humidity sensors were fabricated with DIW printed Ag electrodes and poly (diallyl dimethyl ammonium chloride) (PDDA) sensing layer. Humidity sensing performance of the sensors were examined and by taking advantage the flexibility of printing deposition, DIW printing was used to make quick modification toward a partially covered sensor structure for improved performance. Sensing response of more than 99% was obtained from 10% RH to 90% RH. Smaller hysteresis of ±4.4% RH and faster response of 7 s for adsorption and 213 s for desorption were obtained with the partially covered sensor. DIW printing is found to be a useful tool for device prototyping and ink development of printed electronics.

ObjectiveTo assess the efficacy and safety of RDNI in the treatment of seasonal influenza.Results1575 participants were screened and 229 completed the study and had a RT-PCR laboratory confirmation of influenza virus infection. Fever alleviation time was 2 and 6 hours, and fever clearance time was 27 and 47 in RDNI and oseltamivir, with significant difference between two groups. Total scores of influenza symptoms descended more in RDNI than oseltamivir on day 2 and day 3. Single symptom such as fever, aversion to cold, sore throat and nasal obstruction score descended more in RDNI than oseltamivir on different days. 20 subjects used aspirin during the trial, and there was no significant difference between two groups.Materials and MethodsWe conducted a randomized, double-blind, double-dummy, oseltamivir controlled clinical trial. Patients with a positive influenza rapid test diagnosis were enrolled and randomized to receive RDNI or oseltamivir. Primary outcome was the median fever alleviation and clearance time. Secondary outcomes were total 8 influenza symptom scores, the single influenza symptom score, and the frequency of aspirin usage.ConclusionsThe effect of RDNI was not worse than oseltamivir on the alleviation of influenza symptoms. RDNI was well tolerated, with no serious adverse events noted during the study period.

An iron-based amorphous foil (FeNiCrSiB) was used as an interlayer for the amorphous diffusion bonding of low carbon steel pipes under argon flux. The microstructure and mechanical properties of the joint were analyzed using an electron probe micro-analyzer (EPMA), tensile test, bending test and impact test. The results show that the joint microstructure resembles that of the base metal and no precipitates form at the joint. Melting point depressants (B, Si) diffuse far away from the joint and the base metal element is homogenous across the joint. The joint impact toughness is greater than the base metal toughness and the mechanical properties of the joint are similar around the pipe.