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A novel diamine, 1H,1′H‐(2,2′‐bibenzimidazole)‐5,5′‐diamine (DPABZ), containing bisbenzimidazole unit was successfully synthesized, and used to prepare a series of copolyimides BPDA:(ODAm/DPABZn) by polycondensation with 4,4‐diaminodiphenyl ether (ODA) and 4,4‐biphthalic anhydride (BPDA). For comparison, a series of copolyimides BPDA:(ODAm/PABZn) based on another benzimidazole diamine 5‐amino‐2‐(4‐aminobenzene)‐benzimidazole (PABZ) was also prepared. As a result, with the increase of PABZ or DPABZ content, the heat resistance (Tg and Td) and mechanical properties (σ and E) of the resulting polyimide (PI) films increased, while the coefficient of thermal expansion (CTE) decreased. Overall, the DPABZ‐based PIs showed higher Tg values and much lower CTE values than PABZ. As the content of PABZ increased, the water absorption of PABZ‐based PIs increased obviously, but no significant change in DPABZ‐based PIs. The intramolecular hydrogen bonding in DPABZ‐based PIs caused by the diamine DPABZ was believed to be the reason for the aforementioned differences. The BPDA: DPABZ film with low‐water adsorption of 2.1%, high‐Tg value of 436°C and low‐CTE value of 5.4 ppm/°C could be a promising new generation of flexible display substrates.

A novel modified PBII was achieved. The incorporation of N-phenyl group not only improved the properties but also healed the problem of high H2O-absorption for traditional PBIIs.

A pair of isomer diamines containing both benzimidazole and benzoxazole and derived homopolyimides were synthesized for the first time. Due to rich rigid and linear benzoazole units, as well as the strong intermolecular interactions from the hydrogen bonding and the charge transfer complexation (CTC), the obtained polyimides (PIs) exhibited outstanding thermal properties, including high thermal weight loss temperature (T d5% = 540-561 C), high glass transition temperature (T g = 392-421 C), and low coefficient of thermal expansion (CTE = 1.3-20.9 ppm/ C). In addition, the obtained PIs also showed ideal mechanical properties (T S = 189-240 MPa, T M = 4.1-5.0 GPa and E B = 2.9%-4.7%). These potential novel PI films with high T g and low CTE were expected to be applied to next generation of flexible display substrate material.