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A long-standing goal of GaN device research has been the development of a reliable, well-controlled process for p-GaN formation by ion implantation. Results to date have indicated an activation of 1% or less using high-temperature rapid thermal annealing (RTA) techniques and coimplantation. Although Mg is a relatively deep acceptor, this is still much less than the theoretically achievable value (8.2% based on the 160 meV acceptor level). A multicycle RTA process is presented that is capable of achieving up to 8% activation of the Mg-implanted GaN. This approaches the theoretical value, and represents a significant step in GaN device research.

Epitaxial GaN films were grown by metal organic chemical vapor deposition (MOCVD) on functionalized epitaxial graphene (EG) using a thin (∼11 nm) conformal AlN nucleation layer. Raman measurements show a graphene 2D peak at 2719 cm-1 after GaN growth. X-ray diffraction analysis reveals [0001]-oriented hexagonal GaN with (0002) peak rocking curve full width at the half maximum (FWHM) of 544 arcsec. The FWHM values are similar to reported values for GaN grown by MOCVD on sapphire. The GaN layer has a strong room-temperature photoluminescence band edge emission. Successful demonstration of GaN growth on EG opens up the possibility of III–nitride/graphene heterostructure-based electronic devices and promises improved performance.

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The radiation tolerance of AlGaN/GaN high electron mobility transistors (HEMTs) fabricated on high quality, low threading dislocation density (TDD) ammonothermal GaN and hydride vapor phase epitaxy GaN substrates was studied and compared to the radiation response of devices on SiC substrates where the TDD is 10 4 times higher. Hall and transport measurements were performed as a function of 2 MeV proton fluence. The threading dislocation density had no effect on the radiation response. Comparing the results with published data reveals that almost all irradiated GaN-based HEMTs respond to radiation damage similarly regardless of differences in initial film quality, device structure, aluminum mole fraction, etc. AlGaAs/GaAs HEMTs are also shown to behave similarly but are around ten times more sensitive to radiation damage than GaN-based HEMTs. Known values of the displacement energy thresholds in GaN and GaAs are used to calculate that 36% fewer defects are created in GaN than in GaAs, which is too small to cause a 1000% difference in radiation sensitivity between GaN-and GaAs-based HEMTs. An alternative explanation is proposed in which the piezoelectric field at the AlGaN/GaN interface causes scattered carriers to be reinjected into the 2DEG channel, thereby mitigating some of the harmful radiation effects.