This work documents the annealing effect on the thermal conductivity of nanotube film (CNTB) and carbon nanotube fiber (CNTF). The thermal properties of carbon nanotube samples are measured by using the transient electro-thermal (TET) technique, and the experimental phenomena are analyzed based on numerical simulation. During the current annealing treatment, CNTB1 always maintains the negative temperature coefficient of resistance (TCR), and its thermal diffusivity increases gradually. When the annealing current is 200 mA, it increases by 33.62%. However, with the increase of annealing current, the TCR of CNTB2 changes from positive to negative. The disparity between CNTB2 and CNTB1 suggests that they have different physical properties and even structures along their lengths. The high-level thermal diffusivity of CNTB2 and CNTF are 2.28–2.46 times and 1.65–3.85 times higher than the lower one. The results show that the decrease of the thermal diffusivity for CNTB2 and CNTF is mainly caused by enhanced Umklapp scattering, the high thermal resistance and torsional sliding during high temperature heating.

In recent years, the continuous development of electronic chips and the increasing integration of devices have led to extensive research on the thermal properties of ultrathin metallic materials. In particular, accurate characterization of their thermal transport properties has become a research hotspot. In this paper, we review the characterization methods of metallic nanomaterials, focusing on the principles of the transient electrothermal (TET) technique and the differential TET technique. By using the differential TET technique, the thermal conductivity, electrical conductivity, and Lorenz number of extremely confined metallic nanostructures can be characterized with high measurement accuracy. At present, we are limited by the availability of existing coating machines that determine the thickness of the metal films, but this is not due to the measurement technology itself. If a material with a smaller diameter and lower thermal conductivity is used as the substrate, much thinner nanostructures can be characterized.