Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu 5 Zn 8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.

A bending creep setup was introduced and its feasibility to evaluate creep behavior of materials was experimentally verified on pure Sn. Thereby, the creep of eutectic Sn-9Zn was studied. It was identified that high and low stress regimes exist in the creep of Sn-9Zn, and in both stress regimes, the data obtained well fit the modified equation of Norton power law. Parameters n and Q in the modified Norton equation obtained are very closed to those reported by other researchers by means of conventional tensile creep tests. The mechanisms governing the creep deformation of Sn-9Zn in both stress regimes were also discussed.