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The high dielectric constant ferroelectric-polymer nanocomposite was developed for producing the heat-resistant and chemical stable planar layers. According to the composite coatings formation conditions, the following value ranges of dielectric constant and loss factor were received: 30–400 for dielectric constant and 0.04–0.1 for loss tangent, accordingly. Unlike of composite components, the obtained composite material is characterized by thermo-stability of electrical parameters up to 250 °C. The dielectric frequency spectra of the composite exhibit two clearly visible peaks in contrast to the spectra of the polymer and ferroelectric ceramics. The developed composite material can be used as a built-in film capacitors material in microelectronic devices.

Novel poly(amide‐imide)s and poly(amide‐o‐hydroxy‐imide)s were synthesized in the process of low‐temperature polycondensation of diacid chloride of 2‐(4‐carboxyphenyl)‐1,3‐dioxoisoindoline‐5‐carboxylic acid with a single diamine of 5,5′‐methylenebis(2‐aminophenol (DADHyDPhM) or of 4,4′‐methylenebis(benzeneamine) (DADPhМ), and also with a mixture of named diamines (molar ratios of DADHyDPhM to DADPhМ being equal to 7:3, 1:1, and 3:7). The influence of hydroxy‐imide modifying units (fragments) introduced into the basic poly(amide‐imide) on its thermal stability (the processes of polymers destruction proceed intensively in the temperature range from 400 to 600°C and has a complex character); parameters of pervaporation through heat‐resistant films prepared from polymer solutions were analyzed. Polymer films are rigid materials (modulus of elasticity–3 to 4 GPa) with a strength above 100 MPa. Heating up to 300°C leads for all three compositions to a noticeable increase in the elastic modulus and to a pronounced tendency to increase the strength characteristics.

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