A heat transfer model has been developed to simulate the evolution of temperature during semi-solid metal (SSM) solid freeform fabrication (SFF) process. The governing equations were solved numerically using finite difference method. Deposition of simple cubic components of A356 (Al-7%Si-0.45%Mg) aluminum alloy have been simulated. The effect of process parameters such as deposition pattern, deposition velocity, slurry cross-section and slurry temperature on the transient temperature distribution in these components have been studied. Out of the three deposition patterns studied, i.e. rotating, alternating and unidirectional, the alternating pattern enabled depositing larger interfacefree components. Increasing the slurry flow rate resulted in the deposition of larger interface-free components.