This work is concerned with the preparation and characterization of composite materials prepared by compression molding of a mixture of aluminum flakes and nylon 6 powder. The electrical conductivity, density, hardness and morphology of composites were investigated. The electrical conductivity of the composites is < lo-' S/cm unless the metal content reached the percolation threshold, beyond which the conductivity increased markedly by as much as loll. The volume fraction of conductive filler at the percolation threshold was calculated from experimental data, by fits to functions predicted by the percolation theory. Decreasing the average particle diameter of filler leads to increased percolation threshold (it varies from 23 to 34 vol% for the three different fillers studied] and decreased maximal conductivity of composites. The density of the composites was measured and compared with values calculated assuming different void levels within the samples. Furthermore, it is shown that for certain sizes of particle filler, the hardness decreases initially with the increase of metal concentration, possibly because of poor surface contact with the nylon matrix, but, starting from a certain value, there is a hardness increase. For the smallest particle filler, the hardness of samples is not influenced by the presence of the filler.

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This article reports a study on the structural characterization and evaluation of thermal degradation kinetics of urea-formaldehyde resin modified with cellulose, known as UFC resin. Structural characterization of UFC undertaken by scanning electron microscopy, Fourier transform infrared and X-ray diffraction analyses reveals that the resin is fairly homogenous, and it constitutes of partly crystalline structure including ureaformaldehyde/cellulose interface morphology different from UFC precursors. Measurement of inherent thermal stability, probing reaction complexity and the thermal degradation kinetic analysis of UFC have been carried out by thermogravimetric/differential thermal analyses (TGA/DTA) under non-isothermal conditions. The integral procedure decomposition temperature elucidates significant thermal stability of UFC. TGA/DTA analyses suggest highly complicated reaction profile for thermal degradation of UFC, comprising various parallel/consecutive reactions. Different differential and integral isoconversional methods have been employed to determine the thermal degradation activation energy of UFC. Substantial variation in activation energy with the advancement of reaction verifies multi-step reaction pathway of UFC. A plausible interpretation of the obtained kinetic parameters of UFC thermal degradation with regard to their physical meanings is given and discussed in this study.

This article reports an evaluation study of the thermal degradation mechanisms of electrically insulating and conducting epoxy/Sn composites by using solid-state kinetic approaches and structural characterizations.Comparison of the thermoanalytical data of epoxy/Sn composites with pure epoxy shows that the addition of tin in epoxy catalyzes the thermal degradation of epoxy and the catalytic ability of tin depends upon its contents in epoxy. Kinetic modeling of the phenomena elaborates the thermal behaviors of epoxy/Sn composites in terms of the comparison of their activation parameters and reaction models. Friedman's differential and ArshadMaaroufi's generalized linear integral isoconversional methods are used to obtain the variation in activation energies with the advancement of reaction. Advanced reaction model determination methodology is effectively employed to evaluate the reaction mechanisms of epoxy/Sn composites. Kinetic analysis suggests that tin increases the thermal degradation rate of epoxy by lowering the activation energy barrier of reaction. It is worth noticing that the parameters of the probable reaction model, i.e., Sest ak Berggren have been found nearly the same for pure epoxy and epoxy/Sn composites, revealing weak epoxy-tin interactions in the composites. The mechanistic information obtained by kinetic analysis fairly agrees with the scanning electron microscopy and X-ray diffraction results.