System-on-Package (SOP) technology based on silicon carriers has the potential to provide modular design flexibility and highperformance integration of heterogeneous chip technologies and to support robust chip manufacturing with high-yield/low-cost chips for a wide range of two-and three-dimensional product applications. Key technology enablers include silicon through-vias, high-density wiring, high-I/O chip interconnection, and supporting test and assembly technologies. The silicon through-vias are a key feature permitting efficient area array signal, power, and ground interconnection through these thinned silicon packages. Highdensity wiring and high-density chip I/O interconnection can enable tight integration of heterogeneous chip technologies which approximate the performance of an integrated system-on-chip with a ''virtual chip'' using the silicon package for integration. Silicon carrier fabrication leverages existing manufacturing capability and mid-UV lithography to provide very dense package wiring following CMOS back-end-of-line design rules. Further, the thermal expansion of the silicon carrier package matches the chip, which helps maintain reliability even as the high-density chip microbump interconnections scale to smaller size. In addition to heterogeneous chip integration, SOP products may leverage the integration of passive components, active devices, and electrooptic structures to enhance system-level performance while also maintaining functional test capability and known good chips when needed. This paper describes the technical challenges and recent progress made in the development of silicon carrier technology for potential new applications.

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SummaryWe have designed a robotic arm based on a double parallel four bar linkage to act as an assistant in minimally invasive surgical procedures. The remote center of motion (RCM) geometry of the robot arm kinematically constraints the robot motion such that minimal translation of an instrument held by the robot takes place at the entry portal into the patientApos;s body. In addition to the two rotational degrees of freedom comprising the RCM arm, distal translation and rotation are provided to manoeuver the instrument within the patient's body about an axis coincident with the RCM. An XYZ translation stage located proximal to the RCM arm provides positioning capability to establish the RCM location relative to the patients anatomy. An electronics set capable of controlling the system, as well as performing a series of safety checks to verify correct system operation, has also been designed and constructed. The robot is capable of precise positional motion. Repeatability in the ±10 micron range is demonstrated. The complete robotic system consists of the robot hardware and an IBM PC-AT based servo controller connected via a custom shared memory link to a host IBM PS/2. For laparoscopic applications, the PS/2 includes an image capture board to capture and process video camera images. A camera rotation stage has also been designed for this application. We have successfully demonstrated this system as an assistant in a laparoscopic cholecystectomy. Further applications for this system involving active tissue manipulation are under development.

Data center equipment almost always represents a high expenditure capital investment to the customer, and is often operated without any down time. Data com equipment is typically designed to operate at a rack air inlet temperature of between 10 and 35°C, and a violation of this specification can diminish electronic device reliability and even lead to failure in the field. Thus, it is of paramount importance, from a reliability perspective, to sufficiently understand these systems. A representative non-raised floor data center system was numerically modeled and the data generated from a parametric study was analyzed. The model constitutes a half symmetry section of a 40 rack data center that is arranged in a cold aisle-hot aisle fashion. The effect of several input variables, namely, rack heat load, rack flow rate, rack temperature rise, diffuser flow rate, diffuser location, diffuser height, diffuser pitch, ceiling height, hot exhaust air return vent location, and non-uniformity in rack heat load, was studied. Temperature data was collected at several locations at the inlet to the racks. Statistical analysis was carried out to describe trends in the data.