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Glandular odontogenic cyst (GOC) is an uncommon developmental odontogenic cyst of jaws with a relative frequency between 0.012 and 1.3%. GOC is very rare and only 111 cases have been documented in the English literature so far. Generally, this cyst is encountered in the anterior areas of the mandible and is more common with a wide age range, the mean age being 49.5 years and has a tendency to recur. GOC is often misdiagnosed because of its overlapping histopathological features with that of other odontogenic cysts such as lateral periodontal cyst (LPC) or botryoid cyst and central low-grade Mucoepidermoid carcinoma. Histopathological diagnosis and differential diagnosis of GOC is challenging for pathologist. Here, we present a case of GOC in a 40 year old male patient in left mandibular region that crossed the midline.

Sea of leads (SoL) is disruptive because it intends to use waferlevel batch fabrication of ultra high density (>10 4 /cm 2 ) x-y-z compliant input/output leads and packages as well as wafer level DC/AC testing and burn-in to enhance performance, cost, size, weight, and reliability of a mixed signal SoC. The SoL is accomplished by building flexible embedded leads in a compliant overcoat that facilitates electrical and mechanical connection of the chip to the system module without using underfill as illustrated in Figure 17.7.1. All compliant leads in SoL are concurrently fabricated over the entire wafer and all of the dice within a wafer are packaged simultaneously, which allows the package to be exactly the same size as the chip [1]. The short and highly-reliable compliant leads exhibit minimal parasitics and excellent electrical performance in the GHz range. The wafer level fabrication of SoL and the ability to perform on wafer DC/AC testing and burn-in significantly reduce the manufacturing cost of the package and the time and complexity involved in testing protocols [2]. The monolithic fabrication of compliant leads makes the cost of a package independent of the number of leads. This feature of SoL allows the SoC designer to significantly increase the number of I/O connections and utilize them for more effective signal, power, and clock distribution as well as testing purposes.Ultra high density, 12k leads per cm 2 SoL technology is illustrated in Figure 17.7.2. This array of x-y-z compliant leads is termed sea of leads (SoL). In addition, it is observed in Figure 17.7.2 that the leads are oriented along the contours of expansion to provide a higher degree of compliance moving radialy outward from the center to the edge of the die.High density SoL technology enhances the performance, especially I/O bandwidth, of a mixed-signal SoC. Delay of long global interconnects limits performance. Increasing the cross-sectional area of global interconnects and using repeaters are key for reducing interconnect delay. A common RC model for delay of an interconnect using an optimal number of repeaters is τ=2.5[RintCintR0C0] 1/2 =2.5(l /ω)[ρkεrε0R0C0] 1/2 , (1) where l and ω are wire length and width respectively, ρ is metal resistivity , R0 and C0 are output resistance and input capacitance of a minimum size repeater, εrε0 is the dielectric constant and k is a factor determined by the geometry.Equation (1) is valid for small ω. For large ω, inductance cannot be neglected. Using optimal repeaters and Hspice simulations, wire delay versus width for the geometry of Figure 17.7.3 is shown in Figure 17.7.4. Skin effect is also considered when wire thickness is comparable with skin depth. Figure 17.7.4 shows that as long as the RC model is valid, increasing w decreases delay by the same ratio. However, when ω is large enough so that the RC model deviates from the RLC model, increasing ω does not decrease the delay proportionately. Wire width, which results in a roughly 10% difference between RC and RLC models is an "optimal" value...

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