Copper sulfide thin films and particles were prepared by chemical bath deposition. Bath compositions were altered as well as mechanical processes such as stirring of solutions during the deposition process to determine the effect on the resulting films. The films and particles that were formed homogeneously in the bath solutions were analysed by Raman spectroscopy, electron microscopy, X-ray diffraction and electrochemistry. By changing one of the complexing agents, films and particles with varying copper:sulfur ratios were formed. Films that were deposited while the solution stirred formed a thinner layer than those in which the solution was static during the deposition process. The effect of changing specific parameters included an improvement in adhesion properties, a decreased amount of particulate growth within the bath solution, a decrease in the thickness and roughness of the resulting films, and a change in stoichiometry, although these property changes were not always observed in the same system.