No abstract

Ball grid array (BGA) has the characters of excellent heat dissipation and high mechanical strength to satisfy with the need of high density packaging of electro produces. However BGA faces some problems of complex viscoplastic deformation, difficult failure test and high repair cost. This paper establishes a complex multichip packaging module with lead-free solder ball SAC305 BGA solder ball based on nonlinear Anand viscoplasticity principle. The simulation results are obtained based on the IPC9701 standard thermal cycling condition. The PCB (printed circle board) warpage law and the positions of the dangerous chip and dangerous solder ball are found. The stainstress change rule and hysteresis curve are also obtained. The lifetime of complex packaging model is analyzed based on CoffinManson equation. Result shows that model reliable working time is 399 hours during the IPC9701 standard thermal cycling environment.

BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration analysis on a module by packaging module model of SAC305 lead-free BGA solder joints with ANSYS Workbench finite element analysis software was presented. The natural frequency and vibration model in 0~2000Hz and the maximum 3 equivalent stress (44.627MPa) of BGA solder are obtained . Two improvement program of structure optimization, adding fastening-ring method and adding pillar method, which can be widely used in the engineering application are highlighted. Discussing and verifying that the maximum 3 equivalent stress can be down to 8.7553MPa by adding fastening-ring method, and the reliability of the module resisting vibration is improved.

BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration analysis on a module by packaging module model of SAC305 lead-free BGA solder joints with ANSYS Workbench finite element analysis software was presented. The natural frequency and vibration model in 0~2000Hz and the maximum 3 equivalent stress (44.627MPa) of BGA solder are obtained . Two improvement program of structure optimization, adding fastening-ring method and adding pillar method, which can be widely used in the engineering application are highlighted. Discussing and verifying that the maximum 3 equivalent stress can be down to 8.7553MPa by adding fastening-ring method, and the reliability of the module resisting vibration is improved.

No abstract