Ge incorporation in
HfO2
thin films deposited on Ge substrates by electron-beam evaporation was investigated during dry/wet thermal annealing in
normalN2
ambient. The structural and chemical changes and the electrical properties of
HfO2
were monitored by angle-resolved X-ray photoemission spectroscopy and current–voltage characteristics. Considerable Ge incorporation as
GeOx
in
HfO2
on the Ge substrate during the deposition and annealing processes led to the formation of germanate of hafnium and the deterioration of the leakage current after thermal annealing. The oxidation degree of the incorporated
GeOx
increased with wet annealing time. It was indicated that Ge incorporated in
HfO2
came from Ge upward diffusion from the Ge substrate and the GeO evaporation from the uncovered back side of the Ge substrate.
Metamorphic In
Ga
P/In
Ga
As/Ge triple-junction (3J-MM) solar
cells are grown on Ge (100) substrates via metal organic
chemical vapor deposition. Epi-structural analyses such as
high resolution x-ray diffraction, photoluminence,
cathodoluminescence and HRTEM are employed and the results
show that the high crystal quality of 3J-MM solar cells is
obtained with low threading dislocation density of graded
buffer (an average value of 6.8
10
/cm
. Benefitting from the optimized
bandgap combination, under one sun, AM0 spectrum,
25
C conditions, the conversion efficiency
is achieved about 32%, 5% higher compared with the
lattice-matched In
Ga
P/In
Ga
As/Ge triple junction (3J-LM) solar
cell. Under 1-MeV electron irradiation test, the degradation
of the EQE and
-
characteristics of 3J-MM solar cells is at the same
level as the 3J-LM solar cell. The end-of-life efficiency
is
27.1%. Therefore, the metamorphic
triple-junction solar cell may be a promising candidate for
next-generation space multi-junction solar
cells.
The InAs/GaAs quantum dots structure embedded in GaInP/Ga(In)As/Ge triple junction solar cell with and without Ga0.90In0.10As strain reducing layer was investigated. Conversion efficiency of 33.91% at 1,000 suns AM 1.5D with Ga0.90In0.10As strain reducing layer was demonstrated. A 1.19% improvement of the conversion efficiency was obtained via inserting the Ga0.90In0.10As strain reducing layer. The main contribution of this improvement was from the increase of the short-circuit current, which is caused by the reduction of the Shockley–Read–Hall recombination centers. Consequently, there was a decrease in open circuit voltage due to the lower thermal activation energy of confined carriers in Ga0.9In0.1As than GaAs and a reduction in the effective band gap of quantum dots.
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