No abstract

A self-healing system based on conventional epoxy resin was successfully developed in this work. Epoxy and its hardener mercaptan were microencapsulated as two-component healing agent, and then the microcapsules were embedded in epoxy matrix. Attractive healing effect can be acquired at low capsule content (e.g., 43.5% healing efficiency with 1 wt % capsules and 104.5% healing efficiency with 5 wt % capsules at 20 °C for 24 h). Since only a few healant proves to be sufficient for crack repairing, a better balance between strength and toughness restoration can thus be achieved. As a result of high flowability, fast consolidation, and molecular miscibility of the released healing agent consisting of epoxy and mercaptan, self-healing was allowed to proceed rapidly offering satisfactory repair effectiveness.

No abstract

With the innovation of microelectronics technology, the heat dissipation problem inside the device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced thermal conductivity (TC) in vertical planes was successfully obtained by constructing a vertically aligned silicon carbide nanowires (SiC NWs)/boron nitride (BN) network via the ice template-assisted strategy. The unique network structure of SiC NWs connected to BN ensures that the TC of the composite in the vertical direction reaches 2.21 W m−1 K−1 at a low hybrid filler loading of 16.69 wt%, which was increased by 890% compared to pure epoxy (EP). In addition, relying on unique porous network structure of CA, EP-based composite also showed higher TC than other comparative samples in the horizontal direction. Meanwhile, the composite exhibits good electrically insulating with a volume electrical resistivity about 2.35 × 1011 Ω cm and displays excellent electromagnetic wave absorption performance with a minimum reflection loss of − 21.5 dB and a wide effective absorption bandwidth (< − 10 dB) from 8.8 to 11.6 GHz. Therefore, this work provides a new strategy for manufacturing polymer-based composites with excellent multifunctional performances in microelectronic packaging applications.