In a method developed for measuring the adhesion of metallic films for hybrid microelectronic circuits, pull rods soldered or epoxy bonded to metallization pads are pulled off at an angle normal to the substrate. The test circuits and testing devices are described. Tensile strengths of 40 to 80 N/mm2and 5 to 30 N/mm2are typical for thin-film circuits and thick-film circuits, respectively. The weakest point in the overall circuit configuration is determined. The information obtained indicates the maximum permissible mechanical loads to which the discrete devices of microelectronic circuits can be exposed and may also be evaluated for process optimization.

Tracer experiments on the growth of proper whiskers from evaporated tin layers indicate the existence of solid or nearly solid as well as hollow whiskers. The presence of oxygen during evaporation, resulting in a rapid whisker growth, inhibits large scale diffusion. This inhibition effect must be released, however, at small regions, corresponding to the roots of the whiskers.

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