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A laser ablation technique has been used to fabricate conductor patterns on a 96% alumina substrate to evolve passive fine‐line components and structures. This paper reports the method of fabricating better fine‐line passive components for hybrid microelectronics application. The effect of a laser beam on the conductor and 96% alumina (Al2O3) substrate was studied in detail. Three predominant structures — namely debris, ablation border and irradiated bottom layer — were seen on the patterns. A detailed study of the dendritic growth caused by electrochemical migration on conductor lines fabricated by conventional screen printing and by laser ablation techniques is also reported.

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Temperature humidity acceleration factors for surface conductance are obtained to relate the reliability of film conductors formed by different processes. Analytical expressions for acceleration factor are evolved for both screen‐printed and laser micromachined conductor samples. The rapid solidification of metal conductors due to laser micromachining and its effect on surface conductance are also studied. An analytical expression for the most common accelerated test condition (85°C, 85% relative humidity) is also derived for both screen‐printed and laser micromachined samples.