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A new algorithm for optimizing the thermal layout of basic VLSI elements, taking into account the features of the length of conductors and mutual thermal effects for 3D ICs, is described. It provides a differentiated temperature distribution in different layers of the chip. The algorithm includes parameters such as the length of the conductors, the interlayer transition holes, the power density and, consequently, the temperatures of the corresponding layers, and attempts to ensure a uniform temperature distribution in each layer of the chip. A fundamental difference from existing algorithms is the presence of two localization loops (inside the layer) and global (between layers), as well as using the metric for thermal homogeneity in topology. The novelty of the study lies in the parallel acquisition of a set of alternative solutions and the choice of a quasi-optic one from it. The principal difference lies in the work of the hybrid algorithm with the choice of volatile parameters. The experimental study was carried out for several randomly generated variants of the problem, and a number of well-known comparative tests of MCNC. Based on the results of the experiments, the algorithm showed an improvement in the value of the objective function by 5-10%.

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An attempt to reduce the size of printed patch antenna and arrays severely degrades antenna performance, and it results in increased side lobe level. Electromagnetic band gap (EBG) structure is used to suppress side lobe levels and is utilized to enhance such antenna performance, but it significantly enlarges overall antenna size. This paper proposes a modified EBG structure with wider band gap and compact size. The conventional mushroom EBG geometry is complex due to presence of many vias. The proposed structure is simple to fabricate due to less EBG patches and vias. Also substrate size is significantly reduced by with even much better bandgap. Proposed EBG structure is scaled and tested for X-band applications. It has been observed that the new structure has wider band gap as compared to the reference structure. The integration of proposed EBG with microstrip antenna array has shown significant improvement in antenna parameters like gain, directivity, side lobe level, and radiation efficiency. Index Terms-miniaturization, less via, patch antenna array, wider band gap, compact electromagnetic band gap (EBG)