As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is a kind of thermal conductive material, with silicon oil. In addition, copper powder was mixed with graphene and alumina, respectively, and the thermal conductivity performance was compared. As a result, the thermal conductivity improved by 4.5 W/m·k over the silicon base, and the upward trend of thermal conductivity increased steadily up to 15 vol. %, and the increasing trend decreased after 20 vol. %. In addition, the increased rate of thermal conductivity from 0 to 5 vol. % and 10 to 15 vol. % was the largest.

Mechanical parts have a problem of wear when used in extreme environments. Aluminum, most used in the industrial field, is a representative material of light weight, but its wear resistance is not good. To resolve the wear problem of such materials, research and development of surface thin film deposition technology has been increasing. Wear resistance was investigated after the Ti thin film was deposited by sputtering, one of the main methods of this technique. The smaller the surface roughness value and the thicker the thin film, the better the wear resistance. However, when a thin film is deposited for a predetermined time or less, the bonding strength with the base metal is lowered and the wear resistance is confirmed as low.

Electronic devices and main boards have a tendency to increase the internal heat radiation performance for excellent thermal conductive materials, as necessary for miniaturization. In this study, Nano-thermal grease was prepared by mixing copper Nano-powder into thermal grease, one of the types of thermal conductive materials, by volume percentage. The thermal conductivity was measured and analyzed. As a result, the thermal conductivity was excellent in the order of Case 5, Case 4, Case 3, Case 2, Case 1. However, when the copper powder of Case 5 or more samples was added, stirring did not proceed smoothly due to the high viscosity. This is considered to be because the maximum capacity of the thermal grease was exceeded.

An increase in power consumption density is related to the internal thermal characteristics of an electronic device, and the heat dissipation of the device is directly related to the high performance and miniaturization of the device. TIM (thermal interface material) with excellent internal heat dissipation performance are mainly used to improve the heat dissipation performance of electronic devices. Recently, the need for a high-efficiency TIM with high-performance thermal conductivity and low thermal contact resistance has increased. In this study, thermal grease was prepared by mixing Cu-Ni nanopowders with silicon oil, the thermal grease was then used as a heat transfer material. Compared to silicone thermal grease, the thermal conductivity of all prepared samples was excellent. In particularly, thermal conductivity was improved by about maximum 212% compared to that of thermal silicone of thermal grease mixed with Cu-Ni powder.