With materials innovation driving recent logic and memory scaling in the semiconductor industry, High-Productivity Combinatorial™ (HPC) technology can be a powerful tool for finding optimum materials solutions in a cost-effective and efficient manner. This paper will review unique HPC wet processing, physical vapor deposition (PVD), and atomic layer deposition (ALD) capabilities that were developed, enabling site-isolated testing of multiple process conditions on a single wafer. These capabilities were utilized to generate workflows for exploration of new chalcogenide alloys for phase change memory, and for high-K dielectric metal gate effective work-function measurements for CMOS.