No abstract

Ultraviolet photodetectors (UVPDs) based on Si-Zn-SnO (SZTO) thin-film transistors (TFTs) with a stacked dual-channel layer (DCL) structure with different carrier concentration and NiO capping layer (CL) to alleviate the trade-off between dark current (I dark) and photocurrent (I ph) are reported. Experimental results show that under 275 nm irradiation, the proposed SZTO TFT UVPD with a 30-nm-thick upper layer stacked on a 50-nm-thick channel layer and a patterned NiO CL exhibit excellent photoresponsivity and photosensitivity up to 1672 A/W and 1.03×107 A/A, which is about 272 and 137 times higher than conventional 30-nm-thick single-channel layer SZTO TFT. These improvements are due to the use of DCL forms a high-low junction to reduce the effective channel thickness and increase the space for UV illumination and the use of NiO CL lowers the I dark and causes a considerable negative threshold voltage shift under UV irradiation to significantly boost the I ph.

This paper proposes a solution to mitigate the trade-off between dark and photocurrents in the indium gallium zinc oxide (IGZO) thin-film transistor (TFT) applications, such as ultraviolet photodetectors, by using a stacked Pt/NiO dual capping layer (CL). The Pt CL forms a Schottky contact with the IGZO channel, which maximizes the depletion width on the channel layer and allows the use of a thicker channel to suppress both dark current and channel resistance. On the other hand, the NiO CL forms a pn heterojunction with the IGZO channel, which provides additional space for generating electron–hole pairs and is forward biased by the photovoltaic voltage under UV irradiation, resulting in a further negative shift in the threshold voltage and a significant increase in photocurrent. Experimental results show that the proposed CL scheme exhibits excellent photoresponsivity, photosensitivity, and specific detectivity in a 40 nm-thick IGZO TFT, with the values of 1888 A/W, 3.37 × 108 A/A, and 3.99 × 1016 Jones, respectively, which are about 55%, 83%, and 68% higher than a traditional 30 nm-thick IGZO TFT using only NiO CL under 275 nm UV irradiation.