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Many-body localization (MBL), characterized by the absence of thermalization and the violation of conventional thermodynamics, has elicited much interest both as a fundamental physical phenomenon and for practical applications in quantum information. A phenomenological model, which describes the system using a complete set of local integrals of motion (LIOMs), provides a powerful tool to understand MBL, but can be usually only computed approximately. Here we explicitly compute a complete set of LIOMs with a non-perturbative approach, by maximizing the overlap between LIOMs and physical spin operators in real space. The set of LIOMs satisfies the desired exponential decay of weight of LIOMs in real-space. This LIOM construction enables a direct mapping from the real space Hamiltonian to the phenomenological model and thus enables studying the localized Hamiltonian and the system dynamics. We can thus study and compare the localization lengths extracted from the LIOM weights, their interactions, and dephasing dynamics, revealing interesting aspects of many-body localization. Our scheme is immune to accidental resonances and can be applied even at phase transition point, providing a novel tool to study the microscopic features of the phenomenological model of MBL. arXiv:1901.00034v1 [cond-mat.dis-nn]

Flip-chip architectures have recently enabled significant scaling-up of multi-qubit circuits and have been used to assemble hybrid quantum systems that combine different substrates, for example, for quantum acoustics experiments. The standard flip-chip method uses superconducting galvanic connections between two substrates, typically implemented using sophisticated indium wafer-bonding systems, which give highly reliable and temperature-cyclable assemblies, but are expensive, somewhat inflexible in design, and require robust substrates that can sustain the large compressive forces required to cold-weld the indium bonds. A much simpler method is to assemble dies using very low-force contacts and air-dried adhesives, although this does not provide a galvanic contact between the dies. Here, we demonstrate that the latter technique can be used to reliably couple superconducting qubit circuits, in which the qubits are on separate dies, without the need for a galvanic connection. We demonstrate full vector qubit control of each qubit on each of the two dies, with high-fidelity single-shot readout, and further demonstrate entanglement-generating excitation swaps as well as benchmark a controlled-Z entangling gate between the two qubits on the two dies. This exemplifies a simple and inexpensive assembly method for two-plus-one-dimensional quantum circuit integration that supports the use of delicate or unusually shaped substrates.

Many polycrystalline shape memory alloys, e.g., Co-Ni-Al, Cu-Zn-Al, and Cu-Al-Ni, undergo intergranular fracture. To improve their transformation ductility, we perform Grain Boundary Engineering and stimulate the precipitation of a ductile second phase, which is a face-centeredcubic solid solution, along grain boundaries, by tailoring composition and thermal processing. Orientation imaging confirms precipitation along grain boundaries and unimpeded martensite growth towards grain boundary precipitates. Differential Scanning Calorimetry confirms reversible martensitic transformations in these dual-phase samples. These precipitates can accommodate transformation strain, relieve constraint in adjacent austenite grains, and arrest cracks by extensive plastic deformation, thereby improving transformation ductility and shape memory effects.

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