Hybrid perovskites show enormous potential for display due to their tunable emission, high color purity, strong photoluminescence and electroluminescence. For display applications, full-color and high-resolution patterning is compulsory, however, current perovskite processing such as spincoating fails to meet these requirements. Here, electrohydrodynamic (EHD) printing, with the unique advantages of high-resolution patterning and large scalability, is introduced to fabricate full-color perovskite patterns. Perovskite inks via simple precursor mixing are prepared to in situ crystallize tunableand bright-photoluminescence perovskite arrays without adding antisolvent. Through optimizing the EHD printing process, a high-resolution dot matrix of 5 µm is achieved. The as-printed patterns and pictures show full color and high controllability in micrometer dimension, indicating that the EHD printing is a competitive technique for future halide perovskite-based high-quality display.

Inkjet printing for preparing quantum dot light emitting diodes (QLEDs) has become increasingly attractive due to its large‐area, low‐cost fabrication features. However, the rather low resolution and coarse morphology induced by the printing and uneven evaporation of droplet restrict its further development. Herein, electrohydrodynamic (EHD) printing and mixed solvent method are employed to fabricate high‐resolution pixelated QLEDs. By optimizing the mixed solvent ratio to weaken capillary flow, coffee‐ring‐free quantum dot (QD) films can be obtained. With the help of EHD printing process optimization and pixel defining layers introduction, high‐resolution pixelated QLED with 306 pixels per in. is achieved, which can meet the requirements of manufacturing mobile phones. Finally, an inverted pixelated QLED with a low turn‐on voltage of 3 V and a maximum luminance of 8533 cd m−2 is fabricated, demonstrating that the presented strategy has huge potential in high‐resolution and high‐quality QD display manufacturing.

Recent developments in soft functional materials have created opportunities for building bioelectronic devices with tissue‐like mechanical properties. Their integration with the human body could enable advanced sensing and stimulation for medical diagnosis and therapies. However, most of the available soft electronics are constructed as planar sheets, which are difficult to interface with the target organs and tissues that have complex 3D structures. Here, the recent approaches are highlighted to building 3D interfaces between soft electronic tools and complex biological organs and tissues. Examples involve mesh devices for conformal contact, imaging‐guided fabrication of organ‐specific electronics, miniaturized probes for neurointerfaces, instrumented scaffold for tissue engineering, and many other soft 3D systems. They represent diverse routes for reconciling the interfacial mismatches between electronic tools and biological tissues. The remaining challenges include device scaling to approach the complexity of target organs, biological data acquisition and processing, 3D manufacturing techniques, etc., providing a range of opportunities for scientific research and technological innovation.